Configure this to ensure the impedance calculations are accurate.
Internal copper layers include a Copper Orientation option which defines the direction that the copper is bonded to the core (and then etched from). Surface Finish can be added to an outer copper layer by using the appropriate right-click sub-menu and adding a Surface Finish layer. The layer Material can either be typed into the selected Material cell or selected in the Select Material dialog, which is accessed by clicking the button. If the Stack Symmetry option is enabled in the Board section of the Properties panel, layers are added in matching pairs, centered around the mid-dielectric layer. Adding a Signal or Plane (copper) layer will also add a dielectric layer when an existing adjacent layer is also a copper layer. The new layer will be added next to the layer currently selected in the grid. Right-click in the layer grid, click the button, or use the Edit » Add Layer commands to add a layer. The properties of the currently selected layer can be edited directly in the grid, or in the Properties panel. For a rigid-flex design, layers are also enabled and disabled in this tab. Layers are added, removed and configured in this tab. The Stackup tab details the fabrication layers. The functionality is divided over a number of tabs displayed across the bottom of the Layer Stack Manager: Note that a Save action must be performed in the Layer Stack Manager before changes are reflected in the PCB. All of the standard view behaviors, such as splitting the screen or opening on a separate monitor are supported. The Layer Stack Manager opens in a document editor in the same way as a schematic sheet, the PCB, and other document types do.Īll aspects of layer stack management are performed in the Layer Stack Manager.Īs a standard document editor, the Layer Stack Manager (LSM) can be left open while the board is being worked on, allowing you to switch back and forth between the board and the LSM. To open the Layer Stack Manager select Design » Layer Stack Manager from the main menus. The Layer Stack Manager brings together all of these layer-specific design requirements into a single editor. There are also numerous other design considerations that come into play when designing a modern, high-speed PCB, including layer-pairing, careful via design, possible back drilling requirements, rigid/flex requirements, copper balancing, layer stack symmetry, and material compliance. #LAYER STACKING SOFTWARE SERIES#
No longer just a series of simple copper connections that transfer electrical energy, the routing of many modern PCBs is designed as a series of circuit elements, or transmission lines.Īchieving a successful, high-speed PCB design is a process of balancing the material selection and layer stackup and assignment, against the routing dimensions and clearances required to achieve suitable single-sided and differential routing impedances. The definition of the PCB layer stack is a critical element of successful printed circuit board design. Learn more about the structure of a Printed Circuit Board.To do this, the designer must be able to define multiple PCB layer stacks and assign different layer stacks to different zones of the rigid-flex design.
Since it is fabricated as a single entity, any type of board, including a rigid-flex board, must be designed as a single entity. In printed circuit board design, the layer stack defines how the layers are arranged in the vertical direction, or Z plane. By joining rigid sections of PCB together via flexible sections, complex, hybrid PCBs can be designed that can be folded to fit into unusually shaped enclosures.
Technological innovation and refinements in the processing technology have led to a number of revolutionary concepts in PCB fabrication, including the ability to design and manufacture flexible PCBs. On the right is a rigid-flex PCB, where rigid sections are connected via flexible sections of PCB.įast forward to today, where almost all PCB designs have multiple copper layers. Connections are formed in the copper layer(s) as conductive traces by etching away (removing) unwanted copper.Ī single-sided PCB is shown on the left, typical of early PCB design. In the early days of printed circuit board (PCB) manufacturing, the board was simply an insulating core layer, clad with a thin layer of copper on one or both sides. The PCB is designed and formed as a stack of layers.
High Quality, Flexible Design Documentation. Configuring the Layer Stack for Components Mounted on an Internal Signal Layer. Defining and Configuring the Rigid-Flex Substacks. Materials Library and Library Compliance. Configuring the Layer Properties and Materials.
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